Semiconductor wafer dicing saw



FIG. 1 is a top, left front perspective view of a semiconductor waferdicing saw showing our new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a top, left perspective view of a second embodiment of FIG. 1,the difference being inclusion of coolant controls, camera, bladehousing and chuck;

FIG. 8 is a right side elevational view of FIG. 7;

FIG. 9 is a left side elevational view of FIG. 7;

FIG. 10 is a top plan view of FIG. 7;

FIG. 11 is a bottom plan view of FIG. 7; and,

FIG. 12 is a rear elevational view of FIG. 7.

The broken line showing of keyboard keys, coolant controls, camera,blade housing and chuck in FIGS. 1-4 and 6 is for illustrative purposesonly and forms no part on the claimed design for the embodiment of FIGS.1-6.

The ornamental design for a semiconductor wafer dicing saw, as shown and described. 